Description: Up for auction is a 100mm silicon wafer with 1,000 Angstroms of gold evaporated on the polished side. A 50 angstrom Ti layer is used as an adhesion layer. Silicon wafers are n-type, 1-20 ohms/cm2, thickness is 475-525um thick, & <100> orientation. Auction is for one wafer shipped in wafer carrier.
Price: 30 USD
Location: Glenns Ferry, Idaho
End Time: 2024-08-03T21:08:38.000Z
Shipping Cost: 10.6 USD
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Item Specifics
All returns accepted: ReturnsNotAccepted
Brand: Unbranded
MPN: Does Not Apply
